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Semi Processing Platform Wet Station

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Semi Processing Platform Wet Station
製程 CLEAN
廠牌 RENA

Fast and precise semiconductor processing

High flexibility and precise process control

The automatic wet processing systems for 200 mm and 300 mm wafers support processing with and without carriers. They are engineered for precise process monitoring, high productivity and flexibility during production. The RENA Semi Processing Platform offers maximum production quality and throughput with the flexibility to be adjusted to customer requirements. The platform highlight is a flexible carrierless handling system, which allows parallel processing of different wafer thicknesses.

Technical Data SEMI Processing Platform

Process

Application

Etching (Si-Etch, Metal Etch, Oxide Etch, Nitrid Etch etc.)

Solvent (Metal Lift-off, Resist Strip, BEOL clean etc.)

Cleaning (SPM, SC1, SC2, DHF/O3 etc.)

Drying (IPA Marangoni Dry, IPA Vapor Dry, Hot Water Dry)

Advanced

process control

Chemical/Ozone concentration monitoring and regulation,

DIW-resistivity, precision chemical mixing and spiking, feed & bleed

Substrates

Si, SiC, GaAs, GaN, InP, Glas, Sapphire

Thickness Range

5002000 μm

Housing Material

PP, FM4910-compliant material, Stainless Steel

Dimensions

Width* 2200 mm

Height 3600 mm (including flow box)

Total length according to process specification

* for special applications width can be adapted

Module

Dimensions

Wafersize      200 mm / 8”    300 mm / 12”

2 bath module   1400 mm     1600 mm

3 bath module   2100 mm     2400 mm

Options

Fully automatic loading/unloading buffer station

Customized process carriers

Bulk chemical supply systems

 

 

Semi Processing Platform Wet Station

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